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Built for Makers Robotics • Electronics • DIY

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10g High-Performance Thermal Grease Paste / Heat Sink Compound

Feature	Details
Material	Silicone-based with Metal Oxide / Carbon fillers
Net Weight	10 Grams
Thermal Conductivity	>1.9 W/m-K (varies by grade)
Operating Temp	-50°C to +210°C
Electrical Property	Non-Conductive / Non-Capacitive
Consistency	Non-curing, bleed-resistant paste
Color	Grey (High Performance) / White (Standard)

Price

🚚 Ships within 24 Hours
📦 Pan India Delivery

₹ 16.95

(Tax included)

बारकोड: 41961489

Product Description

The Heat Sink Compound is engineered for stability and reliability under high temperatures. It features low thermal resistance and high conductivity, allowing heat to flow seamlessly from the component to the radiator. Its non-corrosive and non-toxic formula makes it safe for long-term use on sensitive electronic chipsets without the risk of drying out or causing short circuits.

Key Features

Superior Heat Transfer: Specifically formulated to maximize cooling efficiency for high-performance electronics.
Safety Guaranteed: Being electrically non-conductive eliminates the risk of short-circuiting nearby components if the paste spills.
Long-Term Stability: The non-curing and non-drying formula maintains its consistency for years, reducing the need for frequent re-application.
Versatile Application: Ideal for CPUs, VGA cards, MOSFETs, motor drivers, and high-power LED installations.
Easy Application: Usually available in a syringe or compact tub for precise, mess-free application

Technical Details

Thermal Impedance: <0.225 °C-in²/W.
Specific Gravity: >2.0 g/cm³.

Prototyping and Engineering Tips from Robogears

Surface Cleaning: Before applying new paste, thoroughly clean the CPU and heat sink surfaces using 90% Isopropyl Alcohol (IPA) and a lint-free cloth. Any old residue will act as an insulator and reduce cooling efficiency.
The "Pea-Size" Rule: For standard CPUs, apply a small drop (size of a grain of rice) in the center. Let the pressure of the heat sink spread it naturally. Avoid spreading it with your finger, as skin oils can degrade the thermal properties.
Avoid Over-Application: Too much paste can actually hinder cooling by creating a thick layer between the two metal surfaces. The goal is to fill the microscopic "valleys" in the metal, not to create a gap.
Check Idle Temps: After application, boot into your BIOS and check the idle temperature. For most modern CPUs, this should be below 40°C. If it’s higher, the heat sink may not be seated properly or the paste coverage is insufficient.